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RELATED PRODUCTS

• ATCA Product Family
• FlexChassis 3U, 5U, 12U
• FlexCompute ATCA-XE50
• FlexCompute ATCA-XE40
• FlexCompute ATCA-XE30
• FlexCore ATCA-FM40
• FlexCore ATCA-FM30-SX
• FlexPacket ATCA-PP50

Product Brochure

Complete overview of our integrated systems and services.

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FlexCompute ATCA-XE50

The FlexCompute ATCA-XE50 completes Continuous Computing's 10GbE product offering. As the first AdvancedTCA (ATCA) Intel quad-core processor compute blade on the market, the XE50 is the ideal high performance ATCA compute blade which is optimized for telecom equipment manufacturers seeking superior Intel-based processing power. The XE50 provides the flexibility for customizing 10GbE-based systems that power the delivery of video and data content in IPTV networks, security, wireless core, and IP Multimedia Subsystem (IMS)-based broadband solutions.

The XE50's best-in-class performance is driven by two Quad-Core Intel Xeon processors designed with up to 24GB of memory (48GB future), an AdvancedMC slot, and multiple storage options for flexibility. The XE50 is designed as a modular processor blade with 12MB of L2 cache, single & dual processor configurations, and support for multiple operating systems. Additional connectivity is accomplished with a Rear Transition Module featuring multiple USB and GbE and hard drive options.

The XE50 is built on industry standards to ensure easy integration and management for faster time-to-market development. Coupled with Continuous Computing's FlexPacket ATCA-PP50, FlexCore ATCA-FM40, optimized Trillium control and data plane protocol software, and integrated professional services, the XE50 completes the company's industry-leading 10GbE family of ATCA platform solutions. From IPTV servers to session border controllers, the XE50 is the blade of choice for deploying a wide range of high-performance, scalable telecom applications.

FEATURES + BENEFITS

Processing

• 8-way symmetric multiprocessing
• Single & Dual processor configurations of Quad-Core Intel low voltage CPU's

Performance

• 12MB of L2 cache per socket, 1066MHz FSB processor bus and Intel San Clemente chipset
• Intel Extended Memory 64 Technology (EM64T)

Memory

• Supports memory-intensive applications with a maximum capacity of 24GB using 6 Mini-DIMM sockets (48GB future)
• 32MB Persistent Memory
• The Intel San Clemente chipset provides two memory channels giving a theoretical maximum memory bandwidth of 10.6GBps

Connectivity

• Dual 'Base' interface ports provide a redundant 1Gbps path for control and management data
• Fabric Mezzanine
  - 1x dual redundant 10GbE
  - 1x dual redundant 1GbE
• 1 x 1GbE port on front panel and 2 x 1GbE on the RTM for ingress / egress connectivity

SPECIFICATIONS

CPU / Chipset / Memory

• Quad-Core Intel Low Voltage Xeon
• Single & dual processor configurations
• Intel Extended Memory 64 Technology (EM64T)
• 1066 MHz FSB processor bus
• 12MB L2 cache
• 24GB memory using 6 Mini-DIMM sockets (48GB future)
• 32MB of persistent SRAM

Connectivity

• Base interface: 1+1 GbE (10/100/1000 Base-T)
• Fabric Mezzanine:
  - 1 x dual redundant 10GbE
  - 1 x dual redundant 1GbE
  - TCP offload engine
  - iSCSI controller
  - RDMA controller
  - VLAN tagging
  - Congestion control
• 1 x 1GbE port on front panel and 2 x 1GbE on the RTM for ingress / egress connectivity

AMC

• 4 x PCI express lanes
• 8 x I/O to RTM
• 2 x GbE 'management' channel
• 1 x SAS & 1x SATA channels
• Supports Mid-size and Compact AMCs

Storage

• Single 2.5 inch SAS/SATA HDD on RTM
• 1 x SAS & 1 x SATA channel on AMC
• On-board storage SAS/SATA drive
• 8GB Flash storage

Front Panel

• 2 x USB 2.0 port
• 1 x 1GbE port on front panel
• 1 x serial port (micro-DB9)

Rear Transition Model

• 2 x USB
• 2 x SATA + 2x SAS
• 8 x PCI-e
• 8 x I/O from the AMC site
• 2 x 1GbE on the RTM for ingress/egress connectivity

Software Support

• Fedora Linux
• MontaVista CGE
• Wind River PNE
• Other Carrier-Grade Linux integration and support such as Red Hat Linux available via Trillium Professional Services

Mechanical & Environmental Compliance

• Standard 8U single-slot front board and RTM
• Operating and Storage environment:
  - Ambient Temperature: Operating (normal): 5 degC to 40 degC (board intake temperature)
• Operating (short term): -5 degC to 55 degC
• Storage: -40 degC to 70 degC
  - Humidity: Operating: 15% to 90% non-condensing at 55 degC
  - Storage: 5% to 95% non-condensing at 40 degC
  - Vibration: Operating: 5 to 100Hz: 1G @ 0.25 octave/minute; 100 to 500Hz: 1G @ 1 octave/minute
  - Shock (Unpackaged): Operating: 30 G/11 ms half sine; Non-operating: 50 G, 170 inches/second trapezoidal
• Assembly components meet UL 94-V0 flammability rating

Planned Certifications

• UL 60950-1 Safety of Information Technology Equipment
• IEC/EN 60950-1 Safety of Information Technology Equipment
• FCC Part 15, Subpart B, Class A
• CE Mark - Meets EMC directive 89/336/EEC
• Designed for Telcordia NEBS GR-63-CORE and GR-1089-CORE Level 3
• RoHS 6 / 6 Compliant